Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ASSEMBLED WIRE, COIL FORMED BY WINDING ASSEMBLED WIRE, AND METHOD OF MANUFACTURING THE THEM
Document Type and Number:
Japanese Patent JP2009218400
Kind Code:
A
Abstract:

To provide an assembled wire which is improved in heat dissipation property and a space factor, to provide a coil formed by winding the assembled wire, and to provide method of manufacturing them.

Disclosed are the assembled wire 1 such that insulating layers on side surfaces of the assembled wire 1 and contiguous surfaces of insulating coated conductors 10 are thinner than insulating layers 12b on an upper and a lower surface of the assembled wire 1 and insulating layers 12a of the adjacent insulating coated conductors 10 are in contact with each other over the entire surfaces by arranging the assembled wire 1 having the four insulating coated conductors 10 put one over another in parallel in a form block 20 and carrying out compression molding in the stacking direction of the insulating coated conductors 10; and the coil formed by winding the assembled wire 1.


Inventors:
YAMADA KOHAKU
ARIYOSHI TAKESHI
NOMURA YASUSHI
IIZUKA SHINICHI
HIROTA MASAYOSHI
Application Number:
JP2008060924A
Publication Date:
September 24, 2009
Filing Date:
March 11, 2008
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
H01F27/28; H01B7/00; H01B13/00; H01F5/00; H01F41/06
Attorney, Agent or Firm:
Patent Corporation Heart Cluster
Rikio Murota