Title:
はんだペーストを供給する組立体及びその方法
Document Type and Number:
Japanese Patent JP7218299
Kind Code:
B2
Abstract:
The present application provides a method for providing solder paste, for providing solder paste accommodated in a solder paste tub into a solder paste printer, the method comprising: inserting a solder paste nozzle into a housing of the solder paste tub through an opening of the solder paste tub, wherein solder paste is accommodated in the housing of the solder paste tub; bearing the solder paste tub, with the opening facing downward, on a working platform by means of the solder paste nozzle; holding the solder paste tub by mating a holder with an engagement means on an outer wall of the housing of the solder paste tub, the holder being capable of moving up and down with the housing of the solder paste tub; and pressing the housing of the solder paste tub, such that the housing of the solder paste tub moves relative to the solder paste nozzle, at the same time causing the holder to move as the housing of the solder paste tub moves, so as to extrude solder paste accommodated in the housing of the solder paste tub from the solder paste nozzle.
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| WO/1997/045264 | SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD |
| WO/2017/163360 | SCREEN PRINTER AND SCREEN PRINTING METHOD |
| JP3198786 | SCREEN PRINTING METHOD |
Inventors:
Yang Nin
Application Number:
JP2019555898A
Publication Date:
February 06, 2023
Filing Date:
April 13, 2018
Export Citation:
Assignee:
Illinois Tours Works Inc.
International Classes:
B41F15/40; H05K3/34
Domestic Patent References:
| JP2010172928A | ||||
| JP2004306102A | ||||
| JP2015174354A | ||||
| JP2016179579A | ||||
| JP2010179628A | ||||
| JP2014086675A | ||||
| JP2013123889A |
Foreign References:
| KR101570382B1 | ||||
| WO2015083272A1 | ||||
| WO2000061489A1 |
Attorney, Agent or Firm:
Aoki Atsushi
Shinji Mihashi
Shigeki Hirose
Kentaro Ito
Shinji Mihashi
Shigeki Hirose
Kentaro Ito