Title:
ASSEMBLY PROVIDED WITH THERMALLY AND DIMENSIONALLY STABILIZED POLYIMIDE FILM AND ELECTRODE, AND METHOD ABOUT THE SAME
Document Type and Number:
Japanese Patent JP2011122132
Kind Code:
A
Abstract:
To provide an assembly provided with a thermally and dimensionally stabilized polyimide film and an electrode, and a method of the same.
The assembly is provided with the electrode and the polyimide film. The polyimide film contains 40-95 wt.% polyimide derived from at least one kind of an aromatic di-anhydride and at least an aromatic diamine. The aromatic di-anhydride and the aromatic diamine are selected from a combination of a rigidity rod structure A and/or a non-rigidity rod structure B, the ratio by mol of di-anhydride to the diamine is 48-52:(52-48) and the ratio by mol of A:B is 20-80:(80-20). The polyimide film is about <100 nanometer in all sizes and contains 5-60 wt.% filler per total weight of polyimide film.
Inventors:
KOURTAKIS KONSTANTINOS
AUMAN BRIAN C
AUMAN BRIAN C
Application Number:
JP2010209828A
Publication Date:
June 23, 2011
Filing Date:
September 17, 2010
Export Citation:
Assignee:
DU PONT
International Classes:
C08L79/08; C08G73/10; C08J5/18; C08K3/20; H01L31/04
Domestic Patent References:
JPH01131241A | 1989-05-24 | |||
JPH01131242A | 1989-05-24 | |||
JP2004035825A | 2004-02-05 | |||
JP2003306553A | 2003-10-31 | |||
JP2006508527A | 2006-03-09 |
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office