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Title:
ASSEMBLY PROVIDED WITH THERMALLY AND DIMENSIONALLY STABILIZED POLYIMIDE FILM AND ELECTRODE, AND METHOD ABOUT THE SAME
Document Type and Number:
Japanese Patent JP2011122132
Kind Code:
A
Abstract:

To provide an assembly provided with a thermally and dimensionally stabilized polyimide film and an electrode, and a method of the same.

The assembly is provided with the electrode and the polyimide film. The polyimide film contains 40-95 wt.% polyimide derived from at least one kind of an aromatic di-anhydride and at least an aromatic diamine. The aromatic di-anhydride and the aromatic diamine are selected from a combination of a rigidity rod structure A and/or a non-rigidity rod structure B, the ratio by mol of di-anhydride to the diamine is 48-52:(52-48) and the ratio by mol of A:B is 20-80:(80-20). The polyimide film is about <100 nanometer in all sizes and contains 5-60 wt.% filler per total weight of polyimide film.


Inventors:
KOURTAKIS KONSTANTINOS
AUMAN BRIAN C
Application Number:
JP2010209828A
Publication Date:
June 23, 2011
Filing Date:
September 17, 2010
Export Citation:
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Assignee:
DU PONT
International Classes:
C08L79/08; C08G73/10; C08J5/18; C08K3/20; H01L31/04
Domestic Patent References:
JPH01131241A1989-05-24
JPH01131242A1989-05-24
JP2004035825A2004-02-05
JP2003306553A2003-10-31
JP2006508527A2006-03-09
Attorney, Agent or Firm:
Patent Business Corporation Tani/Abe Patent Office