Title:
ASSEMBLY
Document Type and Number:
Japanese Patent JP2015149479
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To reduce a manufacturing cost utilizing punching process and a lamination structure.SOLUTION: An assembly suitable for housing electronic components includes a top shield and a bottom shield 210. The bottom shield 210 has a conductive outer cover 212, a wall section 216, and a laminating portion 214 therebetween. A printed circuit board (PCB) is positioned between the top shield and the bottom shield 210. The laminating portion 214 is formed from a material having required electrical attenuation performance and being suitable for laminating process.
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| JPH0856091 | WAVE ABSORBER |
| WO/2003/069637 | LOW-FREQUENCY MAGNETIC SCREENING MADE FROM A SOFT MAGNETIC ALLOY |
Inventors:
SWAFFORD M DAVID
DASILVA MARCUS K
STEVE U REINHOLD
DASILVA MARCUS K
STEVE U REINHOLD
Application Number:
JP2015020918A
Publication Date:
August 20, 2015
Filing Date:
February 05, 2015
Export Citation:
Assignee:
TEKTRONIX INC
International Classes:
H05K9/00; H05K5/02
Domestic Patent References:
| JPH08330772A | 1996-12-13 | |||
| JP2004111627A | 2004-04-08 | |||
| JP2004072051A | 2004-03-04 | |||
| JPS62118498U | 1987-07-28 | |||
| JPS63133600A | 1988-06-06 | |||
| JPH1198034A | 1999-04-09 | |||
| JPH01225200A | 1989-09-08 |
Attorney, Agent or Firm:
Yamaguchi International Patent Office