Title:
ATTACHMENT DEVICE
Document Type and Number:
Japanese Patent JP2022027859
Kind Code:
A
Abstract:
To provide an attachment device S which enables reduction of surface waving occurring during movement of a sheet.SOLUTION: An attachment device S of the invention moves a sheet 22 with its tip 22a held by holding means 13 to between a stamp plate 11 and a pressure plate 12, which is provided below the stamp plate so as to move in a direction of the stamp plate with reciprocating vertical motion, and presses the pressure plate 12 to the stamp plate 11 to attach a foil material 21 to the sheet 22 by thermal compression bonding. The attachment device S includes guide means 30 which contacts with the sheet during thermal compression bonding between the stamp plate 11 and the pressure plate 12.SELECTED DRAWING: Figure 1
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Inventors:
FUJII RIE
Application Number:
JP2021199709A
Publication Date:
February 14, 2022
Filing Date:
December 09, 2021
Export Citation:
Assignee:
NAT PRINTING BUREAU
International Classes:
B41F16/00; B41M5/00