To provide an automatic impregnating processor capable of easily removing cured materials laminated on a floor of a curing furnace regardless of whether a kind of resin is vanish or resin or whether impregnating process is an impregnating method or precipitating method.
This device conveys (2) an impregnated material for a set of processes, impregnates (3) an insulation vanish or resin consisting of thermal curing resin in an impregnated material by means of an impregnating method or a precipitating method, then dries and cures the insulation vanish or resin with which the impregnated material is conveyed and impregnated into a heating furnace (1). In this case, a floor part (4) of the heating furnace immediately under a conveying path of the impregnated material is of roller movement types (4a, 4b) and comprises a mechanism for moving them outside of the heating furnace, and thereby a cured material of the dropped insulation vanish or resin is removed (5).
JPS54137655 | METHOD OF PACKAGING ELECTRONIC COMPONENTS |
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