Title:
AUTOMATIC MOUNTING APPARATUS OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3623982
Kind Code:
B2
Abstract:
PURPOSE: To obtain an automatic mounting apparatus in which a mounting error due to the attachment error of a suction nozzle is not generated.
CONSTITUTION: An operator attaches all kinds of suction nozzles 14 to be used next to arbitrary positions on a mounting head 15. Then, when the mounting head 15 reaches a part on a component recognition device 16, the tip face of every nozzle 14 is recognized by the device 16, and the kind of every nozzle on every mounting position is detected by a CPU so as to be stored as nozzle data inside a RAM.
Inventors:
Usui Katsuhisa
Yoshinori Kano
Shigeru Kageyama
Yoshinori Kano
Shigeru Kageyama
Application Number:
JP9230894A
Publication Date:
February 23, 2005
Filing Date:
April 28, 1994
Export Citation:
Assignee:
Hitachi High-Tech Instruments Co., Ltd.
International Classes:
B23P21/00; H05K13/04; (IPC1-7): H05K13/04; B23P21/00
Domestic Patent References:
| JP6104596A |
Previous Patent: AUTOMATIC APPARATUS FOR MOUNTING ELECTRONIC DEVICE
Next Patent: IMAGE FILE RECORDING DEVICE AND IMAGE FILE REPRODUCING DEVICE/METHOD
Next Patent: IMAGE FILE RECORDING DEVICE AND IMAGE FILE REPRODUCING DEVICE/METHOD