To provide an automatic soldering apparatus where the occurrence of a solder bridge is suppressed when mounting an integrated circuit element for a game machine on a control substrate for the game machine by solder dipping.

A controller 10 controls a third carrying conveyer 13 to move at a first carrying speed in the case of solder dipping at a place other than the vicinity of the rear end of a substrate carrying direction A' in the mounting area 21 of the element 30, and to move at a second carrying speed faster than the first carrying speed in the case of solder dipping in the vicinity of the rear end of a substrate carrying direction A' in the mounting area 21. Thus, melted solder can sufficiently be stuck to each lead 32 of the element 30 and the electrode pad 23 of the mounting area 21, and a solder sticking amount is prevented from being excessive when a part in the vicinity of the rear end of a substrate carrying direction A' in the mounting area 21 is separated from the melted solder supplied from a jet nozzle 4a, thereby reliably suppressing the occurrence of the solder bridge.