PURPOSE: To execute satisfactory soldering to a high density surface mounting substrate by placing a secondary fluxer being different from a primary fluxer between a primary jet type solder tank and a secondary jet type solder tank.
CONSTITUTION: A fluxer 34, a preheater 35, a jet type solder tank 37, and a cooling fan 38 are placed along a conveyor 32, and fluxing, preheating, soldering and cooling are performed to a work 31. Subsequently, soldering is executed by providing a secondary fluxer 42, a secondary preheater 43, a secondary jet type solder tank 45, and a secondary cooling fan 46 on the downstream side of the cooling fan 38. That is, between the primary jet type solder tank 37 and the secondary jet type solder tank 45, the secondary fluxer 42 is placed separately from the primary fluxer 34. In such a way, a condition of a solder wave, etc., can be set optimumly.
OKANO TERUO
TAKAHASHI TAKAO
KOBAYASHI NOBUTAKA
