PURPOSE: To provide the automatic treating device and method for substrates which eliminates the contamination by a cassetter housing the substrates and is constituted to execute the conduction inspection and electrolytic treatment of the substrates at need.
CONSTITUTION: The automatic treating device for the substrates 1 is constituted of a cassetter 11 which houses the plural substrates 1, a substrate holding section 21 which has plural chucks 22 for holding the respective plural substrates 1 housed in this cassetter 11, and a driving means 20 which drives this substrate holding section 21 to execute taking or housing of the substrates 1 out of or into the cassetter 11, transporting of the substrates 1, immersing or pulling up of the substrates 1 in a treating chamber section 30, and holding of the substrates 1 in the treating chamber section 30. An alignment mechanism 15 which perpendicularly arranges the substrates 1 in the cassetter 11 is provided in the side parts of the plural substrates 1 housed into the cassetter 11. A conduction inspection mechanism which inspects the disconnection and short circuiting of electrodes by coming into contact with the detecting terminals of the conductive electrodes formed on the substrates 1 at the time of crimping the substrates 1 with the chucks 11 at need is provided on the crimping surfaces of the chucks 11.
YOKOYAMA SEIICHIRO
KURATA HIDEAKI
| JP1068332B |