Title:
AUTOMATIC WAFER CUTTING METHOD
Document Type and Number:
Japanese Patent JPS5548930
Kind Code:
A
Abstract:
PURPOSE:To automate the processes from cutting to storing wafers by fitting a cutting blade into the groove on a crystal bar; cutting them while turning it round with the use of a roller; simultaneously rolling a plurarity of wafers on a slanted table in order to store them in a casette. CONSTITUTION:A crystal bar 13 of which the exterior surface has been finished with etching is placed between a grinding wheel 4 for cutting a groove and a roller for turning the crystal bar round. The crystal bar is pressed to the grinding wheel 4 while giving the bar a spinning motion with the roller, and a groove having the depth required is cut into the whole circumference of the bar 13. The bar 13 with the groove is pushed out over the grinding wheel 4 and led to a slanted table 8. Then the bar is pressed in such a manner that a multiple blade edge 9 reciprocating in a direction perpendicular to the slanting table can fit into the groove of the bar 13, then a spinning motion is given to the bar by a roller 10, so that the bar is amputated at that position. Simultaneously, a plurarity of cut wafers are rolled on the slanted table 8 and received by a cassette 12 for containing them. Therefore, it can automatically be conducted wituout the help of man power from cutting the specified number of wafers out of the crystal bar to storing them up in a cassette.
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Inventors:
WATANABE JIYUNJI
Application Number:
JP12037178A
Publication Date:
April 08, 1980
Filing Date:
October 02, 1978
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
H01L21/304; B28D1/00; B28D5/04; (IPC1-7): H01L21/302