Title:
アビオニクスシャーシ
Document Type and Number:
Japanese Patent JP5469745
Kind Code:
B2
Abstract:
An avionics chassis comprises a housing having a substantially thermally non-conductive frame comprising a composite of carbon fibers laid up in an epoxy matrix. The housing also includes at least two walls, at least one of which is a thermally conductive wall comprising a composite of carbon fibers in a carbonized matrix, and a plurality of spaced, thermally-conductive, card rails provided on the at least two walls. The at least two walls are mounted to the frame in opposing relationship such that corresponding card rails on the walls define an effective slot therebetween in which a printed circuit board may be received and the card rails and the at least one thermally conductive wall form a thermally conductive path from the interior to the exterior.
Inventors:
Vander, Plog Benjamin John
Steinwijk, Meredith Marie
Coxson, Danny Weldon
Strayl, John Jay
Steinwijk, Meredith Marie
Coxson, Danny Weldon
Strayl, John Jay
Application Number:
JP2012516088A
Publication Date:
April 16, 2014
Filing Date:
May 05, 2010
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
H05K7/20; B64D47/00; H05K5/02; H05K7/14
Domestic Patent References:
| JP2002151878A | ||||
| JP2009135446A | ||||
| JP53051950U | ||||
| JP2003526199A |
Foreign References:
| EP0632688A2 |
Attorney, Agent or Firm:
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka
Hirokazu Ogura
Toshihisa Kurokawa
Takuto Tanaka