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Title:
BACKING MATERIAL FOR POLISHING PAD
Document Type and Number:
Japanese Patent JP2005161489
Kind Code:
A
Abstract:

To provide a backing material for a polishing pad for providing a product superior in finishing accuracy, by stably and quickly polishing a base board such as a silicon wafer and a hard disc or a base board requiring surface flatness to a high degree such as the other information recording base board.

This backing material 3 for the polishing pad is characterized by boring a large number of small holes at a predetermined interval in a sheet, by forming the sheet by molding high polymer elastomer.


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Inventors:
YOSHIOKA TAKASHI
KANAYAMA TOMOAKI
SHIN GAKUJI
Application Number:
JP2003406009A
Publication Date:
June 23, 2005
Filing Date:
December 04, 2003
Export Citation:
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Assignee:
DIATEX KK
MITSUBISHI CHEM CORP
International Classes:
B24B37/20; B24B37/24; C08J5/18; H01L21/304; (IPC1-7): B24B37/00; C08J5/18
Attorney, Agent or Firm:
Eiichi Maruyama
Takaya Yamamoto



 
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