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Title:
BACKING PLATE MADE OF COPPER ALLOY, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2008050655
Kind Code:
A
Abstract:

To provide a method for manufacturing a copper alloy for a backing plate, which has characteristics that are conventionally required to the backing plate (for instance, thermal conductivity, mechanical strength and heat resistance), and has superior oxidation resistance as well particularly so as to cope with the request of upsizing the backing plate, and to provide the backing plate using the copper alloy.

The copper alloy for the backing plate comprises 0.02 to 0.2 mass% Zr and the balance Cu with unavoidable impurities; and has crystals of which the maximal size is controlled to 0.08 mm or smaller. The manufacturing method comprises: a casting step of casting the copper alloy; a hot rolling step of heating the ingot at 800C or higher for 30 minutes or longer, and hot-rolling the ingot at a working rate of 50% or more; and a cold rolling step of cold-rolling the hot-rolled plate with a working rate of 50% or more.


Inventors:
NOMOTO NORIYUKI
FUYU KIYOUHEI
NOMURA KATSUMI
KODAIRA MUNEO
YAMAMOTO YOSHINORI
ODAKURA MASAMI
OKANO MASAKI
Application Number:
JP2006228196A
Publication Date:
March 06, 2008
Filing Date:
August 24, 2006
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
C22C9/00; B21B1/26; B21B1/28; B21B3/00; C22F1/08; C22F1/00
Domestic Patent References:
JPH01180975A1989-07-18
JP2002356728A2002-12-13
JP2005133185A2005-05-26
JP2004100041A2004-04-02
JPS4220624B1
JPH06264216A1994-09-20
Attorney, Agent or Firm:
Tadao Hirata
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama