Title:
BACKLIGHT MODULE
Document Type and Number:
Japanese Patent JP2007287556
Kind Code:
A
Abstract:
To provide a backlight module high in heat resistance.
In this backlight module, LEDs 2 are arranged adjacently to one side surface 1a of a light guide plate 1; and light emitted from the LEDs 2 is entered into the one side surface 1a of the light guide plate 1 and emitted from the upper surface 1b of the light guide plate 1. In the backlight module, a light-transmitting member 3 high in heat resistance as compared with that of the light guide plate 1 is arranged between the one side surface 1a of the light guide plate 1 and the LEDs 2.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
YAMAZAKI TSUTOMU
Application Number:
JP2006115845A
Publication Date:
November 01, 2007
Filing Date:
April 19, 2006
Export Citation:
Assignee:
SHARP KK
International Classes:
F21V8/00; G02B6/00; G02F1/13357; F21Y101/02
Attorney, Agent or Firm:
Shizuo Sano
Shigeki Yamada
Shigeki Yamada
Previous Patent: COLOR PICTURE TUBE
Next Patent: ORGANIC SEMICONDUCTOR DEVICE, OPTICAL HEAD USING THIS, AND IMAGE FORMING DEVICE
Next Patent: ORGANIC SEMICONDUCTOR DEVICE, OPTICAL HEAD USING THIS, AND IMAGE FORMING DEVICE