Title:
BAND PASS FILTER CIRCUIT
Document Type and Number:
Japanese Patent JP3018737
Kind Code:
B2
Abstract:
PURPOSE: To exactly attain a soldering by protruding one part of the holes of a printed circuit board outside from the outer peripheral equipment of a surface acoustic wave band pass filter (SAW-BPF), and venting a gas, at the time of soldering the outer peripheral equipment and the print circuit board.
CONSTITUTION: Holes 9, 10, and 11 among the input and output terminals of an SAW-BPF 1 satisfies the suction of the soldering, and its size is half the size among the terminals so that the sucked soldering can be prevented from being brought into contact with the input and output terminals, and the surrounding foils of the holes 9, 10, and 11 are cut out. A conductive plating processing is operated to the wall faces of the holes 9, 10, and 11, and they are connected with electric connection faces, and the soldering of the outer peripheral equipment of the BPF 1 and a print circuit board 3 is operated by a flow dip. At that time, one part of the holes 9, 10, and 11 of the printed circuit board 3 protrudes outside from the outer peripheral equipment, and the gas vent is operated, so that the soldering can be exactly attained. Thus, the holes 9, 10, and 11 which are filled with the soldering exist among the input and output terminals of the BPF 1, so that the among-the input and output terminals can be efficiently separated, and an induction among the terminals can be reduced.
Inventors:
Fuyuki Okubo
Noriaki Ohmoto
Noriaki Ohmoto
Application Number:
JP13040792A
Publication Date:
March 13, 2000
Filing Date:
May 22, 1992
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H03H9/145; H03H9/25; H04B1/08; H04B1/26; H05K1/02; H05K3/34; (IPC1-7): H04B1/08; H03H9/145; H03H9/25; H04B1/26
Domestic Patent References:
| JP453305A | ||||
| JP4233310A | ||||
| JP272710A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)