To miniaturize a band saw device with which a silicon ingot is cut into a predetermined shape.

The band saw device includes two parallel-arranged blade wheels 6, an annular band saw 7 wound around the two blade wheels 6, a motor 8 as a drive source rotatably driving the band saw 7 via the blade wheels 6, and an ascending and descending means 10 letting the silicon ingot 2 to ascend and descend to the rotatably driven band saw 7. The band saw 7 and the two blade wheels 6 around which the band saw 7 is wound are arranged between a space S of a gate type holding frame comprising a pillar frame 4 and a beam frame 5. The two blade wheels 6 around which the band saw 7 is wound are hung down and held in the lower part of the horizontal beam frame 5 mounted on the holding frame. Thereby it is possible to hold the band saw 7 and the two blade wheels 6 without increasing the rigid force of the holding frame holding the same.