Title:
紙幣処理装置および紙幣処理システム
Document Type and Number:
Japanese Patent JP7336353
Kind Code:
B2
Abstract:
To suppress the occurrence of storage abnormality of bound bills due to deviation of the thickness of the bundled bills.SOLUTION: A control unit (100) performs first control in bundling storage processing. In the bundling storage processing, bundled bills in which directions of a predetermined number of bills are aligned in a predetermined direction are generated in a bundling unit (402), and the bundled bills are accumulated in a bundled bill storage unit (406). In the first control, the control unit (100) controls a bill processing device (20) to operate so that first bundled bills (B1) in which directions of a predetermined number of bills are aligned in a first direction and second bundled bills (B2) in which directions of a predetermined number of bills are aligned in a second direction different from the first direction are generated in the bundling unit (402), and the first bundled bills (B1) and the second bundled bills (B2) are stored in the bundled bill storage unit (406).SELECTED DRAWING: Figure 9
Inventors:
Masayuki Mukita
Application Number:
JP2019194700A
Publication Date:
August 31, 2023
Filing Date:
October 25, 2019
Export Citation:
Assignee:
Glory Co., Ltd.
International Classes:
G07D11/00; B65H15/00; B65H31/00
Domestic Patent References:
| JP2013250667A | ||||
| JP2016177570A | ||||
| JP2017174422A |
Foreign References:
| WO2010103617A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Maeda Patent Office