PURPOSE: To increase density for mounting by dividing a resist layer into two layers and providing a difference in height to the opening of the resist layer to offset the expansion of a mold and besides forming such a structure as to dam up a mold by a frame produced from outside silk printing.

CONSTITUTION: A semiconductor integrated circuit substrate 102 is bonded on a mounted circuit base board with a die-bonding agent 103, and an Al pad 104, 105 is connected with the integrated circuit substrate 102 with use of a wiring pattern 106, 107 and an Au wire 105, 109 on the mounted circuit base board. In such a mounting structure, a first and a second resist layer 110, 111 for electrically insulating a wiring pattern provided on a base board 101 are concentrically formed, thereby making it feasible to limit the expansion of a mold agent 112 to a small degree. Also, a mold frame 113 formed on a silk- printed layer is provided outside the opening of the second resist layer 111, thereby damming up the mold agent 112.