Title:
マイクロニードルパッチ用のベース組成物及びこのベース組成物を含むマイクロニードルパッチ
Document Type and Number:
Japanese Patent JP6868913
Kind Code:
B2
Abstract:
The present invention relates to a base composition for a microneedle patch and a microneedle patch comprising the same. The base composition comprises a first HPMC, a second HPMC and PVP/VA, wherein the viscosity of the first HPMC is greater than that of the second HPMC, the weight ratio of the first HPMC relative to the second HPMC is 1:0.1 to 1: 1.2, and the amount of the PVP/VA is 0.25 wt% to 2 wt%. By controlling the constitution of the base composition, the microneedle patch can not only be demolded smoothly during the stage of the production, but also obtain the desired softness, flatness, flexibility, skin adhesion during the stage of use and humidity resistance during the stage of storage.
Inventors:
Liu Dae
Leaf Shuho
Hayashi Tamaki
Chen Yuan
Hiroboshi Hayashi
Leaf Shuho
Hayashi Tamaki
Chen Yuan
Hiroboshi Hayashi
Application Number:
JP2019228368A
Publication Date:
May 12, 2021
Filing Date:
December 18, 2019
Export Citation:
Assignee:
Yosadako Technology Co., Ltd.
International Classes:
C08L1/26; A61K8/02; A61K8/73; A61K8/81; A61K9/70; A61K47/32; A61K47/38; A61Q19/00; C08L31/04; C08L39/06
Domestic Patent References:
| JP6172160A | ||||
| JP2000297102A | ||||
| JP2010525109A | ||||
| JP5221854A |
Attorney, Agent or Firm:
Hajime Amano