Title:
BASE MATERIAL BONDING APPARATUS AND BASE MATERIAL BONDING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2018018997
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a base material bonding apparatus capable of bonding a base material at normal temperature without heat-treating the base material to remove moisture therefrom, and to provide a base material bonding method using the same.SOLUTION: A base material bonding apparatus 100 for bonding a first base material 11 consisting of at least one kind of semiconductor material, compound semiconductor material, and metallic material and a second base material 12, includes: a lower stage 113 for holding the first base material 11; an upper stage 115 for holding the second base material 12; a lifting cylinder 114 for lifting the upper stage 115; an exhaust pump 116 for exhausting a chamber 111; a gas source 117 for supplying gas 1, such as Ar, into the chamber 111; electrode plates 113a, 115a and an AC power supply 118 for generating plasma 2 of the gas 1 between the upper and lower stages 113, 115; and an earth 119 for making plasma particles Mp collide against the surface of the first base material 11 and deposit on the surface of the second base material 12.SELECTED DRAWING: Figure 1
Inventors:
UCHIUMI ATSUSHI
IDE KENSUKE
SUZUKI TAKENORI
GOTO TAKAYUKI
IDE KENSUKE
SUZUKI TAKENORI
GOTO TAKAYUKI
Application Number:
JP2016149296A
Publication Date:
February 01, 2018
Filing Date:
July 29, 2016
Export Citation:
Assignee:
MITSUBISHI HEAVY IND MACHINE TOOL CO LTD
International Classes:
H01L21/02; B23K20/00; H01L21/3065
Attorney, Agent or Firm:
Toshiro Mitsuishi
Mitsuishi Shunpei
Yasuyuki Tanaka
Hiroshi Matsumoto
Tetsuzo Yamada
Mitsuishi Shunpei
Yasuyuki Tanaka
Hiroshi Matsumoto
Tetsuzo Yamada