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Title:
BASE MATERIAL OF SUBSTRATE FOR ELECTRONIC AND ELECTRICAL APPLIANCES
Document Type and Number:
Japanese Patent JPH05117789
Kind Code:
A
Abstract:

PURPOSE: To enhance the strength of a base material forming substrates for various electronic and electrical appliances.

CONSTITUTION: This base material forming substrates for various electronic and electrical appliances is made of a Cu alloy having a compsn. consisting of 0.1-1wt.% Cr and the balance Cu with inevitable impurities or further contg. 0.005-0.2wt.% Zr and/or 0.001-0.5wt.% Si and/or Mg.


Inventors:
TATSUTA SHUNTARO
IMADA HIROSHI
ISHIKAWA TETSUYA
Application Number:
JP30525091A
Publication Date:
May 14, 1993
Filing Date:
October 24, 1991
Export Citation:
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Assignee:
MITSUBISHI SHINDO KK
International Classes:
C22C9/00; H01L23/14; (IPC1-7): C22C9/00; H01L23/14
Attorney, Agent or Firm:
Kazuo Tomita (1 person outside)



 
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