Title:
電子部品付き基材及びその製造方法
Document Type and Number:
Japanese Patent JP7429426
Kind Code:
B2
Abstract:
To provide a base material with an electronic component that has the function of a cloth or paper base material itself and is equipped with an electronic component without peeling, breaking, or deformation.SOLUTION: The base material with an electronic component includes a base material composed of either cloth or paper, a conductive region provided inside the base material in part or the whole of the thickness of the base material, in which the conductive material is penetrated between the fibers inside the base material, and a solder part that electrically and mechanically connects an electronic component arranged on the surface of the base material with the conductive region of the base material. The conductive region contains a conductive material and an organic polymer binder that penetrate from the surface of the base material to a predetermined depth.SELECTED DRAWING: Figure 2
Inventors:
Tomoya Koshi
Kenichi Nomura
Manabu Yoshida
Kenichi Nomura
Manabu Yoshida
Application Number:
JP2020010059A
Publication Date:
February 08, 2024
Filing Date:
January 24, 2020
Export Citation:
Assignee:
National Institute of Advanced Industrial Science and Technology
International Classes:
H05K1/02; D03D1/00; D03D15/533; D04B1/14; D04B21/00; D06M11/83; H05K3/10; H05K3/34
Domestic Patent References:
| JP61051893A | ||||
| JP2019134123A | ||||
| JP2005524783A | ||||
| JP2005036324A |
Foreign References:
| WO2018123977A1 | ||||
| WO2017057195A1 |