基材レス粘着テープ

Title:

基材レス粘着テープ

Document Type and Number:

Japanese Patent JP7127154

Kind Code:

B2

Abstract:

The present invention relates to a substrate-free adhesive tape that is excellent in adhesive physical properties and is suitable for a continuous process.

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Inventors:

Ki Seung Seo
The Hee Kim
San Juan Kim
Jun Hyun Park
Kyung Jun Yoon

Application Number:

JP2020565251A

Publication Date:

August 29, 2022

Filing Date:

August 06, 2019

Export Citation:

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Assignee:

LG HAUSYS,LTD.

International Classes:

C09J7/38; C09J7/10; C09J133/14

Foreign References:

US20170166786
KR20170115197A

Attorney, Agent or Firm:

Shinya Mihiro
Takashi Watanabe

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