Title:
ビードワイヤ包装装置、及び、包装方法
Document Type and Number:
Japanese Patent JP6845933
Kind Code:
B2
Abstract:
The present invention discloses a bead wire wrapper device and a wrapper method. The bead wire wrapper device comprises a rack body; the rack body is provided with a winding unit, an H-shaped wheel assembly, a paper cutting mechanism, a paper guiding mechanism and a rubber applying mechanism; the winding unit comprises a first winding shaft and a second winding shaft; the H-shaped wheel assembly comprises an H-shaped wheel and a drive unit driving the H-shaped wheel to rotate; the paper cutting mechanism is configured to cut off film materials directly or indirectly fed by the winding unit; the paper guiding mechanism comprises a motion mechanism, the motion mechanism is provided with an adsorption assembly and a pressing assembly, the adsorption assembly is configured to adsorb the film materials through negative pressure and send the cut-off tail ends of the film materials to the H-shaped wheel under the action of the motion mechanism, and the pressing assembly is configured to move to the H-shaped wheel under the action of the motion mechanism and press the film materials; and the rubber applying mechanism is configured to paste rubber strips to the film materials on the H-shaped wheel.
Inventors:
Lee Wen Jun
Application Number:
JP2019528814A
Publication Date:
March 24, 2021
Filing Date:
May 31, 2018
Export Citation:
Assignee:
Shandon Daye Company Limited
International Classes:
B65B11/04; B65B41/16; B65H23/032
Domestic Patent References:
| JP2016097975A |
Foreign References:
| CN203032955U | ||||
| CN205574331U |
Attorney, Agent or Firm:
Nagoya International Patent Service Corporation