Title:
曲げ加工システム
Document Type and Number:
Japanese Patent JP4637082
Kind Code:
B2
Abstract:
Several methods and subsystems are disclosed for aligning a workpiece as it is being loaded into a die space of a bending apparatus, and for performing sensor-based control of a robot as it moves a workpiece from one location to another within a bending apparatus environment. A backgaging mechanism is provided with finger gaging mechanisms having force sensors for sensing forces in directions perpendicular to and parallel to a die. In addition, a robot gripper sensor is provided for sensing either or both of shear forces and normal forces created by movement of a workpiece being held by the gripper. Several sensor-based control modules are disclosed, including a bend-following control module, a speed control module, a module for actively damping vibrations in a workpiece, a module for controlling active compliance/contact between a workpiece and an obstacle, a module for performing a guarded move to intentionally bring a workpiece into contact with an obstacle, and a module for detecting unintentional impacts between a workpiece and an obstacle. Several droop sensing methods and systems are also disclosed, including methods for performing droop sensing and compensation with the use of a vision-based droop sensor, a compound break-beam droop sensor, and a single break-beam droop sensor. In addition, an angle sensor is disclosed, along with a springback control method utilizing the disclosed angle sensor.
Inventors:
Moor Richard M Junior
Bone David Alan
Elkins Kelly El
Marian Marie
Sturgis Robert H. Jr.
Hazama Kensuke
Bone David Alan
Elkins Kelly El
Marian Marie
Sturgis Robert H. Jr.
Hazama Kensuke
Application Number:
JP2006316002A
Publication Date:
February 23, 2011
Filing Date:
November 22, 2006
Export Citation:
Assignee:
Amada Co., Ltd.
International Classes:
B21D5/02; B21D5/00; B21D43/00; B23Q3/18; B23Q15/22; B23Q17/22; B25J9/16; B25J19/02
Domestic Patent References:
JP8132368A | ||||
JP60104679A | ||||
JP6246658A |
Attorney, Agent or Firm:
Hidekazu Miyoshi