Title:
ベンゾオキサジン化合物、ベンゾオキサジン樹脂、ベンゾオキサジン化合物の製造方法、硬化性樹脂組成物、その硬化物、ＦＲＰ材料、半導体封止材料、ワニス、回路基板、プリプレグ、及びビルドアップフィルム
Document Type and Number:
Japanese Patent JP6766316
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a benzoxazine compound excellent in various physical properties such as heat resistance, resistance to heat decomposition, flame retardancy and dielectric characteristics in an obtained cured product; a benzoxazine resin; a method for producing the benzoxazine compound; a curable resin composition; its cured product; an FRP material; a semiconductor sealing material; a varnish; a circuit board; a prepreg; and a build-up film.SOLUTION: A benzoxazine compound is formed by reacting a phenol compound with a diamine compound, an aromatic monohydroxy compound and formaldehyde. The phenol compound has a diarylene[b,d]furan structure, at least one arylene group in the two arylene groups forming the diarylene[b,d]furan structure has a naphthylene skeleton and each of the two arylene groups has a hydroxyl group in the aromatic ring thereof.SELECTED DRAWING: None
Inventors:
Ayumu Takahashi
Yasushi Sato
Yasushi Sato
Application Number:
JP2014260079A
Publication Date:
October 14, 2020
Filing Date:
December 24, 2014
Export Citation:
Assignee:
DIC Corporation
International Classes:
C07D498/14; C08G14/073; C08J5/04; C08J5/18; C08J5/24; C08L61/34; H01L23/29; H01L23/31; H05K1/03; H05K3/46
Domestic Patent References:
| JP2016121209A | ||||
| JP2016113581A | ||||
| JP2000086863A | ||||
| JP2009114443A | ||||
| JP2007008842A |
Foreign References:
| WO2014208131A1 | ||||
| WO2014208132A1 | ||||
| WO2014199659A1 |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno