BIMETAL TAB TAPE USING POSITIVE PHOTOSENSITIVE MATERIAL, ITS MANUFACTURING METHOD, LAMINATED TAB, TAPE, AND SEMICONDUCTOR DEVICE

Title:

BIMETAL TAB TAPE USING POSITIVE PHOTOSENSITIVE MATERIAL, ITS MANUFACTURING METHOD, LAMINATED TAB, TAPE, AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2001267375

Kind Code:

A

Abstract:

To speed up the via hole machining of an insulation layer, and at the same time, to reduce manufacturing cost by using a positive photosensitive resin in an insulation layer used between copper foil.

A film, having a three-layer structure where copper foil 2 and 3 is formed on both sides of a positive photosensitive resin layer 1 in advance, is used After a circuit pattern 12, such as a via hole is formed the copper foil 3, the photosensitive resin layer 1 is exposed to light via the circuit pattern 12, and a via hole 13 is formed in the photosensitive resin layer 1 through chemical liquid treatment. After that, copper plating is made to the via hole 13 to allow the circuit pattern 12 of the copper foil 3 to be continuous electrically to the copper foil 2, and the circuit pattern is formed on the copper foil 2.

Inventors:

MORISHITA SHIGEHIRO
OKABE MASAHIRO
YOSHIOKA OSAMU

Application Number:

JP2000079286A

Publication Date:

September 28, 2001

Filing Date:

March 16, 2000

Export Citation:

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Assignee:

HITACHI CABLE

International Classes:

H01L21/60; (IPC1-7): H01L21/60

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