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Title:
双峰性ポリエチレン組成物及び該組成物から製造される製品
Document Type and Number:
Japanese Patent JP5153989
Kind Code:
B2
Abstract:
The invention relates to a polyethylene composition with a bimodal molecular weight distribution and articles made therefrom, such as high topload blow moldings and transmission and distribution pipes. The composition comprises a low-molecular-weight (LMW) ethylene homopolymer component and a homogeneous, high-molecular-weight (HMW) ethylene interpolymer component, wherein the LMW component is characterized as having a molecular weight distribution, MWDL, of less than about 8. The composition is characterized as having a bimodal molecular weight distribution, and a ductile-brittle transition temperature, Tdb, of less than −20° C. In some embodiments, the HMW component is characterized by a reverse comonomer distribution.

Inventors:
Van Dun, Joseph, Jay.
Schouterden, Patrick, Jay.
Sehanovish, Kalyan
Van den Bergen, Peter, F., M.
Jiblaj, Nulara
Van Vourden, Joan
Dixito, Ravi, Es.
Nikaji, Rudy
Gemoz, Frederik, Yi.
Application Number:
JP2003521716A
Publication Date:
February 27, 2013
Filing Date:
August 16, 2002
Export Citation:
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Assignee:
Dow Global Technologies LLC
International Classes:
C08L23/04; C08F10/00; C08F10/02; C08F210/16; C08L23/06; C08L23/08; C08F4/659; C08F110/02
Domestic Patent References:
JP11106574A
JP11199719A
JP2004513202A
JP2002519496A
JP2003507493A
Attorney, Agent or Firm:
Hiroshi Kobayashi
Eiji Katayama
Norio Omori
Kyoei Sugiyama
Yasuhito Suzuki



 
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