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Patent Searching and Data


Title:
BIODEGRADABLE RESIN COMPOSITION, MOLDING MATERIAL AND PROCESS FOR PRODUCING BIODEGRADABLE RESIN MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2008127499
Kind Code:
A
Abstract:

To provide a biodegradable resin composition which uses a shellac resin utilized, for example, in coating materials and adhesives in addition to molding materials, and suitably used in electrical/electronic materials and in the civil engineering/construction field, has sufficient moldability for practical purposes and from the standpoint of industrial production, and excels in water resistance and impact resistance.

The biodegradable resin composition comprises a shellac resin and a metal alcoholate or a metal complex. Preferably, the biodegradable resin composition comprises the metal alcoholate or the metal complex as a crosslinking agent for the shellac resin.


Inventors:
FUJIEDA SHINETSU
YAMAMOTO MASAAKI
FUKAYA TARO
WATARIDO HIROKO
Application Number:
JP2006315919A
Publication Date:
June 05, 2008
Filing Date:
November 22, 2006
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
C08L93/02; C08J3/12; C08K5/057; C08L101/06; C08L101/16
Attorney, Agent or Firm:
Amagi International Patent Office