Title:
BLOCK COPOLYMERIZED POLYIMIDE FILM AND METHOD FOR MOLDING THEREOF
Document Type and Number:
Japanese Patent JP2001040108
Kind Code:
A
Abstract:
To provide a polyimide film and a method for molding thereof.
This method of molding a polyimide film comprise coating a polyimide solution on a surface of a base film, forming the polyimide film by drying the coat, peeling off the formed polyimide film from the base film, and drying and dehydrating the film to have a thickness of 0.5-10 μm. The polyimide solution is prepared by heating a tetracarboxylic acid dianhydride and a diamine in a mole ratio of the dianhydride to the diamine being 1.05-0.95 in the presence of an acid catalyst in a solvent.
Inventors:
MATSUMOTO SHUNICHI
ITAYA HIROSHI
ITAYA HIROSHI
Application Number:
JP24602799A
Publication Date:
February 13, 2001
Filing Date:
July 28, 1999
Export Citation:
Assignee:
PI GIJUTSU KENKYUSHO KK
International Classes:
C08J5/18; C08G73/10; (IPC1-7): C08J5/18; C08G73/10