To provide a board assembling method for a board connector in which an excellent solder fillet is formed.
A board assembling method for a board connector comprises: a solder coating step of coating a board 20 with a through hole 21 having solder 22; a connector mounting step of mounting a connector housing 2 on the board 20 in a state where a terminal 10 of the board connector 1A is inserted into the through hole 21 and solder is stuck on a tip of the terminal 10 that penetrates through the through hole 21 after the solder coating process; and a reflow step of forming a solder fillet with which remaining solder on the board 20 and the solder stuck on the tip of the terminal 10 connect by heating the solder 22 after the connector mounting step. The connector housing 21 is provided with an excessive insertion restricting projection 4 whose bottom surface is at a position of height equal to or higher than that a substrate mounting surface 2a and which protrudes by a protrusion size equal to or larger than the projection length of the terminal 10, and the excessive insertion restricting projection 4 stops the terminal 10 from being excessively inserted into the through hole 21 in the connector mounting step.
| JPS5259878 | CONNECTION |
| WO/2023/282016 | JOINED STRUCTURE, AND METHOD FOR PRODUCING SAID JOINED STRUCTURE |
| JPH10224024A | 1998-08-21 | |||
| JPS63123075U | 1988-08-10 | |||
| JPS5111948U | 1976-01-28 | |||
| JPS52134069U | 1977-10-12 | |||
| JPH10224024A | 1998-08-21 | |||
| JPS63123075U | 1988-08-10 | |||
| JPS5111948U | 1976-01-28 | |||
| JPS52134069U | 1977-10-12 |
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu