To provide a board having high workability, adhesive force, insulation reliability, and durability by mixing one or more kinds selected thermoplastic resin, a thermosetting resin, and crosslinked polymer particles in the adhesive forming the adhesive layer of the board and, at the same time, to provide parts constituting the board and a semiconductor device.
A particle-dispersed solution is prepared by mixing methylsiloxane- crosslinked polymer particles in a mixed solvent containing toluene and methyl ethyl ketone at a mixing ratio of 1:1 and treating the mixture in a sand mill. Then an adhesive solution is prepared by adding NBR-C, a brominated epoxy resin, a non- brominated epoxy resin, 4,4' diaminodiphenyl sulfone, and methyl ethyl ketone which is added to the same weight as that of the dispersed solution to the dispersed solution and agitating and mixing the solution. The adhesive solution is applied to a polyethylene terephthalate film. On the other hand, and adhesive layer is formed by using the same method except the used of a polyethylene terephthalate film coated with a silicone mold-release agent having a weak peel force. Then the adhesive layer and the polyethylene terephathalate film are put together by sticking their adhesive surfaces to each other.
ANDO YOSHIO
SAWAMURA TAIJI
