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Patent Searching and Data


Title:
BOARD MOLDED PRODUCT AND MOLDING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2002321240
Kind Code:
A
Abstract:

To enhance the productivity of a board molded product having a grain-like decorative pattern formed to the design surface thereof and to also well keep the quality of the design surface.

In the method for molding the board molded product, natural fibers are wound around a board base material 30 over both surfaces thereof and, in such a state that a thermoplastic resin material is applied to the natural fibers, the board base material 10, the natural fibers and the thermoplastic resin material are pressed under heating to form a grain pattern to the surface of the board base material 10.


Inventors:
IWASAKI HIRONOBU
INAO TAKASHI
Application Number:
JP2001394722A
Publication Date:
November 05, 2002
Filing Date:
December 26, 2001
Export Citation:
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Assignee:
ARACO CORP
TOYOTA MOTOR CORP
International Classes:
B27D5/00; B27M3/00; B29C43/18; B32B27/04; B29K101/12; B29K105/06; B29K105/20; B29K311/10; (IPC1-7): B29C43/18; B27D5/00; B27M3/00; B32B27/04
Attorney, Agent or Firm:
Hidehiko Okada