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Patent Searching and Data


Title:
BOARD FOR MOUNTING ELECTRONIC COMPONENT FOR HIGH SPEED PROCESSING
Document Type and Number:
Japanese Patent JPH05267561
Kind Code:
A
Abstract:

PURPOSE: To improve electric connection property and mounting arrangement property by bare-mounting an LSI for MPU barely on the first mounting part.

CONSTITUTION: An electronic component mounting board consists of a synthetic resin board provided with the first mounting part 1 for bare-mounting an LSI11 for MPU, the second mounting part 2 for mounting a memory LSI, and the third mounting part 3 for mounting a capacitor for prevention of noise. Moreover, conductor circuits 4 for transferring electric signals are made, respectively, between the first mounting part 1 and the first pad 111, between the second mounting part 2 and the second pad 20, and between the third mounting part 3 and the third pad 30. A connector 5 for transferring electric signals with outside are made in the conductor circuit 4. Moreover, the second mounting part 2 and the third mounting part 3 are made in the vicinity of the first mounting part 1. Thus an LSI11 for MPU is bare-mounted on the first mounting part 1, so it can exhibit the essential high-speed processing ability of the LSI11 for PPU.


Inventors:
Masahiro Ueda
Yoshihiko Kiritani
Hitoshi Ito
Maruyama Jin
Teruyo Tsukada
Katsumi Azaka
Application Number:
JP9481992A
Publication Date:
October 15, 1993
Filing Date:
March 21, 1992
Export Citation:
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Assignee:
IBIDEN CO.,LTD.
International Classes:
H01L25/18; H01L25/04; H05K1/18; (IPC1-7): H01L25/04; H01L25/18; H05K1/18
Attorney, Agent or Firm:
Yoshiyasu Takahashi