Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
BOARD FOR MOUNTING ELECTRONIC PARTS, AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH07231147
Kind Code:
A
Abstract:

PURPOSE: To provide a board for mounting electronic parts which can prevent the outflow of a mount material and besides is excellent in heat radiation and moisture resistance, and its manufacture.

CONSTITUTION: This device has an insulating board 79 provided with a mount for electronic parts and a plurality of heat conductive holes 75 which are provided below the mount 70 for electronic parts and besides pierce the insulating board 70. The inwall of the heat conductive holes 75 is covered with a metal- plated film 5. It is to be desired that the topside and the underside of the heat conductive hole 75 should be covered with metal-plated films 55. The heat conductive hole 75 opened to the mount 70 for electronic parts is covered with, for example, a mount material 6.


Inventors:
HAYASHI TERUO
YATSU HAJIME
Application Number:
JP4197694A
Publication Date:
August 29, 1995
Filing Date:
February 15, 1994
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; H05K1/02; (IPC1-7): H05K1/02; H05K3/46
Attorney, Agent or Firm:
Yoshiyasu Takahashi



 
Previous Patent: presentation system

Next Patent: CIRCUIT BOARD AND BOARD DIVIDER