Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2022083842
Kind Code:
A
Abstract:
To increase the throughput of a substrate processing device.SOLUTION: The substrate processing device includes: a carrier block; a first processing block composed of mutually laminated first lower side processing blocks and first upper side processing blocks; a second processing block composed of mutually laminated second lower side processing blocks and second upper side processing blocks; a relay block having an elevation transfer mechanism; and a bypass transfer mechanism provided in a bypass transfer path formation block, which is one of the upper side processing block and the lower side processing block, for each of the first processing block and the second processing block, to operate to form a forward path or a return path together with a main transfer mechanism of the bypass transfer path formation block, so that the bypass transfer path formation block transfers a substrate toward a downstream side block by one of a main transfer mechanism of the first processing block and a main transfer mechanism of the second processing block.SELECTED DRAWING: Figure 1
Inventors:
WATANABE TAKASHI
TSUCHIYAMA MASASHI
ENOKIDA SUGURU
YAMAMOTO TARO
TSUCHIYAMA MASASHI
ENOKIDA SUGURU
YAMAMOTO TARO
Application Number:
JP2020195412A
Publication Date:
June 06, 2022
Filing Date:
November 25, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027; B05C13/02; H01L21/677
Attorney, Agent or Firm:
Patent Corporation Yayoi Patent Office