Title:
SUBSTRATE PROCESSING DEVICE AND STORAGE MEDIUM
Document Type and Number:
Japanese Patent JP2022018648
Kind Code:
A
Abstract:
To efficiently improve flatness of a substrate processed after self-ground of a substrate holding section in a device for processing the substrate.SOLUTION: A substrate processing device processes a substrate. A control section controls a substrate holding section, a first grinding section, and a measuring section so as to perform self-ground of the substrate holding section using a first grinding wheel, to hold the substrate by the substrate holding section after the self-ground, to grind the substrate held by the substrate holding section by the first grinding wheel, to measure thickness at a plurality of points in a radial direction of the substrate after ground with the first grinding wheel by the measuring section, and to determine whether thickness at the plurality of points in the radial direction of the substrate measured by the measuring section is within an allowable range.SELECTED DRAWING: Figure 6
Inventors:
SAKAGAMI TAKASHI
Application Number:
JP2020121897A
Publication Date:
January 27, 2022
Filing Date:
July 16, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
B24B7/00; B24B41/06; B24B49/02; B24B53/02; B24B53/12; H01L21/304
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine
Koji Hagiwara
Naoki Ogita
Takashi Saito
Takuya Mine