Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2022026661
Kind Code:
A
Abstract:
To suppress a decrease in the temperature of a circulated processing liquid when the processing liquid is discharged to a substrate.SOLUTION: A substrate processing apparatus (10) includes a substrate processing unit (100) that processes a substrate (W), a circulation flow path (330) in which a heater (313) that heats a processing liquid supplied to the substrate processing unit (100) is arranged, and through which the processing liquid circulates, a discharge flow path (132) that is branched from the circulation flow path (330) and flows the processing liquid to the substrate processing unit (100), and a valve (136) arranged in the discharge flow path (132). A part of the circulation flow path (330) is arranged along a part of the discharge flow path (132).SELECTED DRAWING: Figure 6
Inventors:
INOUE MASASHI
Application Number:
JP2020130231A
Publication Date:
February 10, 2022
Filing Date:
July 31, 2020
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/306; H01L21/027; H01L21/304
Attorney, Agent or Firm:
Hiroyuki Maei
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