To provide a means for laminating and bonding a printed circuit board with a reinforcing film, free from foaming on the laminated face and carried out in a typical laminating apparatus.
The method comprises following processes, a first process preparing a laminate comprising an adhesive layer composed of a curable adhesive in semi-cured state and flat liners put on both surfaces of the adhesive layer and releasing the flat liner and then bonding with a surface of a first adherend (the reinforcing film), a second process forming a fine embossed pattern by releasing the other flat liner from the laminate and crimping an embossed liner having a fine embossed pattern face onto the surface of the adhesive layer, and a third process hot-pressing a second adherend (a flexible printed circuit board) on to the other surface of the adhesive layer having fine embossed pattern on the surface, by releasing the embossed liner from the other surface of the adhesive layer.
MIKAMI HARUYUKI
YAMAZAKI HIDEO
Koji Kikawa
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