Title:
BOILING COOLING DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2022110792
Kind Code:
A
Abstract:
To provide a boiling cooling device and its manufacturing method, capable of improving cooling performance while securing insulation quality to a heating element.SOLUTION: A boiling cooling device includes; a plate main body portion 1 having a first plate 11 receiving heat, a second plate 12 disposed in opposition to the first plate 11, and a rib portion 13 connecting the first plate 11 and the second plate 12, and forming a refrigerant flow channel 14 between the first plate 11 and the second plate 12; and a boiling acceleration portion 2 disposed on an opposite surface 11b of the first plate 11 and accelerating boiling of a refrigerant. The plate main body portion 1 is composed of ceramics powder for main body, and the boiling acceleration portion 2 is composed of ceramics powder for lamination, having a particle diameter larger than a particle diameter of the ceramics powder for main body. The plate main body portion 1 and the boiling accelerating portion 2 are integrally formed by being sintered, the plate main body portion 1 is a dense sintered body, and the boiling acceleration portion 2 is a particle laminate in which the ceramics powder for lamination is laminated in a particulate form.SELECTED DRAWING: Figure 1
Inventors:
TAKAHASHI EIZO
KAWAMOTO YOICHIRO
KAWAMOTO YOICHIRO
Application Number:
JP2021006416A
Publication Date:
July 29, 2022
Filing Date:
January 19, 2021
Export Citation:
Assignee:
DENSO CORP
International Classes:
F28D15/04; B32B5/16; B32B18/00; F28D15/02; H01L23/427; H05K7/20
Attorney, Agent or Firm:
Patent Business Corporation Kaisei Patent Office