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Title:
BONDED LAMINATED BAMBOO MATERIAL AND LAMINATE MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP2001105408
Kind Code:
A
Abstract:

To provide a bonded laminated bamboo material having a best suited structure for forming a smoothly shaped bonded laminated material free from distortion or deformation due to a change with time, and a laminated material using the same.

A plurality of bamboo strips 1, obtained by cutting a bamboo in the long direction, of a transversely long rectangular section, are arranged side by side so that the front/back faces of a plurality of the bamboo strips 1 are adjacent to each other. At the same time, the adjacent bamboo strips 1 are bonded in parallel in such a way that the front/back faces are reversed to form a flat boardlike intermediate layer A. Further, the side faces, other than the front/back faces, of the bamboo strips 1, are bonded in parallel to the front/back side face parts of the intermediate layer A in such a manner that the side faces of the strips 1 are adjacent to each other. Thus a front face layer B and a back face layer C which are formed like a flat board, are added to form the bonded laminated bamboo material.


Inventors:
YOSHIKAWA YOSHIHIKO
Application Number:
JP29264899A
Publication Date:
April 17, 2001
Filing Date:
October 14, 1999
Export Citation:
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Assignee:
ORIENTAL KK
International Classes:
B27J1/00; B27M3/00; B32B9/02; E04C2/24; E04F13/10; (IPC1-7): B27J1/00; B32B9/02; E04C2/24; E04F13/10
Attorney, Agent or Firm:
Tsuyoshi Yoshii (1 person outside)