Title:
BONDED STRUCTURE, LIQUID CRYSTAL DEVICE, AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP3876993
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To realize a bonded structure which can increase the force of adhesion to each object to be bonded, even in the case of the adhesion to two kinds of the objects to be bonded, different in the properties of materials, and to prevent the occurrence of a poor connection between electrode terminals which are formed in the objects to be bonded.
SOLUTION: The thickness of the electrode terminal 12 from the surface of a glass substrate 11 is smaller than that of the electrode terminal 14 from the surface of a tape carrier package (TCP) 13; a first adhesive layer 4 and a second adhesive layer 5 are laminated together in an adhesive 1; the adhesive layer 4 includes conductive particles 3; the thickness of the adhesive layer 4 is greater in dimension than the diameter of the conductive particle 3; the force of the adhesion of the adhesive layer 4 to the glass substrate 11 is greater than that of the adhesion of the adhesive layer 5 thereto; and the force of the adhesion of the adhesive layer 5 to the TCP 13 is greater than that of the adhesion of the adhesive layer 4 thereto.
Inventors:
Shinji Uchiyama
Application Number:
JP2003337421A
Publication Date:
February 07, 2007
Filing Date:
September 29, 2003
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
B32B7/02; G02F1/1345; B32B27/18; C09J5/04; C09J7/00; C09J9/02; C09J11/04; C09J11/06; C09J133/00; C09J153/02; C09J163/00; C09J167/00; C09J175/04; C09J201/00; H01L21/60; H05K1/14; (IPC1-7): B32B7/02; C09J5/04; C09J9/02; C09J11/04; C09J11/06; C09J133/00; C09J153/02; C09J163/00; C09J167/00; C09J175/04; C09J201/00; H01L21/60; H05K1/14
Domestic Patent References:
| JP4366630A | ||||
| JP3530980B2 |
Attorney, Agent or Firm:
Yasuo Ishii
Masahiko Ueyanagi
Fujitsuna Hideyoshi
Osamu Suzawa
Masahiko Ueyanagi
Fujitsuna Hideyoshi
Osamu Suzawa