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Title:
BONDING AGENT OF ANISOTROPIC CONDUCTION
Document Type and Number:
Japanese Patent JP3522634
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a thermosetting bonding agent of the anisotropic conduction type capable of estabilishing electrical connection between microstructural circuits even under low-temperature short-work conditions, excellent in bonding strength, connection reliability, preservation stability, and in repairability.
SOLUTION: The bonding agent of the anisotropic conduction type comprises the bifunctional polyurethane acrylate resin (A) described by formula (1), an organic peroxide (B), a thermoplastic elastomer (C), the phosphoric ester (D) described by formula (2) (wherein R is CH2=CR1CO(OR2)n; R1 is -H or -CH3; R2 is -C2H4-, -C3H6-, -CH2CH(CH3)-, -C4H6, -C5H10-, -C6H12 or -C2H4-O-CO-C5H10-; and n is an integer of 1-10), an epoxysilane coupling agent (E), and conductive particles (F) dispersed into the resin composition.


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Inventors:
Miyamoto, Tetsuya
Kawada, Masakazu
Application Number:
JP2000078106A
Publication Date:
April 26, 2004
Filing Date:
March 21, 2000
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO LTD
International Classes:
C09J4/06; C09J9/02; C09J171/00; C09J175/16; H01B1/22; H01B1/24; H01B5/16; (IPC1-7): C09J4/06; C09J9/02; C09J175/16; H01B1/22; H01B1/24; H01B5/16



 
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