To provide a tape with a bonding agent for a semiconductor device, which has an excellently high bondability and an excellently low warpage property, and to provide a semiconductor substrate for connection using that tape and a semiconductor device.

A bonding agent sheet for a semiconductor device is characterized in that the bonding agent sheet has a laminated material which consists of more than at least one layer of protective layers and a bonding agent layer, the bonding agent layer contains a thermoplastic resin (A), an epoxy resin (B) and a curing agent (C) and the epoxy resin (B) at least contains a compound which is formulated by the following general formula (1). [compound 1] (provided that, R1 to R16 show hydrogen atoms, 1 to 4c of lower alkyl groups or hydrogen atoms and the R1 to R16 may be the same as each other or may be different from each other, respectively).