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Title:
BONDING APPARATUS
Document Type and Number:
Japanese Patent JPH05121471
Kind Code:
A
Abstract:

PURPOSE: To reduce operation mistakes as far as possible by a method wherein the area occupied by an operating panel in a bonding apparatus is reduced, the operating panel and the apparatus as a whole are made small-sized, the number of operating keys on the operating panel is reduced and the operation of the keys is simplified.

CONSTITUTION: In a bonding apparatus which is provided with chessmen 21, 22 for X-Y tabel movement use, the following are provided: a monitor 14 for numerals, characters and the like; and rotary encoders 23, 24 which detect the action amount of the chessmen 21, 22. In addition, the following are provided: a data input device in which the detection result of the rotary encoders 23, 24 is used as the input value of numerals, characters and the like; and a display control part 27 which displays the numerals, the characters and the like corresponding to the input value of the data input device on the monitor on the basis of the input values.


Inventors:
SAITO AKIHIDE
Application Number:
JP30383191A
Publication Date:
May 18, 1993
Filing Date:
October 24, 1991
Export Citation:
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Assignee:
TOSHIBA SEIKI KK
International Classes:
G12B5/00; H01L21/52; (IPC1-7): G12B5/00; H01L21/52
Attorney, Agent or Firm:
Shuji Shiokawa



 
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