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Title:
BONDING COMPOSITION
Document Type and Number:
Japanese Patent JPH0481483
Kind Code:
A
Abstract:

PURPOSE: To obtain the subject composition, composed of a molten mixture of a crystalline olefinic polymer with a thermoplastic polyamide, an unsaturated carboxylic acid (anhydride) and an organic peroxide and capable of exhibiting excellent adhesive strength to nonpolar and polar substrates.

CONSTITUTION: The objective composition is composed of a molten mixture of (A) a polymer component composed of (i) 95-30wt.% crystalline olefinic polymer [preferably propylene (co)polymer having 100-200°C melting point] and (ii) 5-70wt.% thermoplastic polyamide (preferably a dimer acid-based polyamide or nylon 12) with (B) an unsaturated carboxylic acid (anhydride) (preferably maleic anhydride) and (C) an organic peroxide (e.g. dicumyl peroxide). Furthermore, the blending ratios of the components based on 100 pts.wt. component (A) are preferably 0.01-5 pts.wt. component (B) and 0.01-5 pts.wt. component (C).


Inventors:
KAWASAKI EIICHI
DOI KIYOTO
KITAMURA TADASHI
YASHIRO KENICHI
Application Number:
JP19540090A
Publication Date:
March 16, 1992
Filing Date:
July 24, 1990
Export Citation:
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Assignee:
MITSUI TOATSU CHEMICALS
International Classes:
C08F291/00; C09J151/00; C09J151/06; C09J151/08; (IPC1-7): C08F291/00; C09J151/06; C09J151/08
Attorney, Agent or Firm:
Toshizo Iida



 
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