Title:
BONDING DEVICE
Document Type and Number:
Japanese Patent JP2020165017
Kind Code:
A
Abstract:
To provide a bonding device capable of shortening a heating time of an adhesive at the time of starting, while suppressing defective coating of the adhesive.SOLUTION: A bonding device comprises a nozzle, a heater, and a temperature sensor. The nozzle discharges an adhesive on a lower sheet. The heater is disposed in a channel for supplying the adhesive to the nozzle. The temperature sensor detects a temperature of the heater. At the time of starting the bonding device, a CPU of the bonding device controls the heater so that the detected temperature which is a temperature detected by the temperature sensor, becomes the start-up temperature (S17). The start-up temperature is a temperature higher than a predetermined temperature which is a temperature suitable for discharging the adhesive on the lower sheet. After completion of the control of the heater, the CPU controls the heater so that the detected temperature becomes the predetermined temperature.SELECTED DRAWING: Figure 13
Inventors:
MINAGAWA YUICHIRO
UMEDA KAZUTOSHI
IWAKOSHI HIROYASU
KOKURYU TAKAHIRO
TADA SATORU
UMEDA KAZUTOSHI
IWAKOSHI HIROYASU
KOKURYU TAKAHIRO
TADA SATORU
Application Number:
JP2019065116A
Publication Date:
October 08, 2020
Filing Date:
March 28, 2019
Export Citation:
Assignee:
BROTHER IND LTD
International Classes:
A41H43/04
Attorney, Agent or Firm:
Hisashi Yamamoto