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Title:
BONDING DEVICE AND BONDING
Document Type and Number:
Japanese Patent JP2591600
Kind Code:
B2
Abstract:

PURPOSE: To prevent damage to a lead due to adhesion of a bonding tool to the lead and reduction in junction strength between the lead and an electrode of a semiconductor element, and to prevent reduction in reliability of junction due to adhesion of Sn formed on the surface of the lead to the surface of the bonding tool.
CONSTITUTION: A semiconductor element 1 having an electrode 5 is held by a bonding tool 40 having heating means 41. The bonding tool 40 holding the semiconductor element 1 is moved toward a lead 4 set on a device 43 located at a position facing the bonding tool 40. Thus, the lead 4 and the electrode 5 are pressurized in contact with each other, and the pressurized portion is heated by the heating means 41 so as to join the lead 4 with the electrode 5.


Inventors:
HATADA KENZO
Application Number:
JP1995000200693
Publication Date:
March 19, 1997
Filing Date:
August 07, 1995
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
JP60130837A
JP6046039A
JP5338262A
JP58122450U
JP666361B2
Attorney, Agent or Firm:
前田 弘 (外2名)



 
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