Title:
BONDING DEVICE AND BONDING
Document Type and Number:
Japanese Patent JP2591600
Kind Code:
B2
Abstract:
PURPOSE: To prevent damage to a lead due to adhesion of a bonding tool to the lead and reduction in junction strength between the lead and an electrode of a semiconductor element, and to prevent reduction in reliability of junction due to adhesion of Sn formed on the surface of the lead to the surface of the bonding tool.
CONSTITUTION: A semiconductor element 1 having an electrode 5 is held by a bonding tool 40 having heating means 41. The bonding tool 40 holding the semiconductor element 1 is moved toward a lead 4 set on a device 43 located at a position facing the bonding tool 40. Thus, the lead 4 and the electrode 5 are pressurized in contact with each other, and the pressurized portion is heated by the heating means 41 so as to join the lead 4 with the electrode 5.
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Inventors:
HATADA KENZO
Application Number:
JP20069395A
Publication Date:
March 19, 1997
Filing Date:
August 07, 1995
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP60130837A | ||||
| JP6046039A | ||||
| JP5338262A | ||||
| JP58122450U | ||||
| JP666361B2 |
Attorney, Agent or Firm:
Hiroshi Maeda (2 outside)