Title:
BONDING GOLD WIRE
Document Type and Number:
Japanese Patent JPH08325657
Kind Code:
A
Abstract:
PURPOSE: To obtain high reliability in assembling a semiconductor device by incorporating specified amts. of Sb, Bi and B into high-purity gold.
CONSTITUTION: The IC chip bonding gold wire contains, by weight, at least one kind between 0.00050.01% Sb and 0.0001-0.005% Bi, 0.00002-0.001% Be, and further at least one kind between 0.00005-0.01% Ca and 0.0001-0.01% Ge in ≥99.999% high-purity gold. As a result, the breaking performance is improved.
Inventors:
KURIHARA KENICHI
TAKAURA SHIN
TAKAURA SHIN
Application Number:
JP12807995A
Publication Date:
December 10, 1996
Filing Date:
May 26, 1995
Export Citation:
Assignee:
TANAKA ELECTRONICS IND
International Classes:
C22C5/02; H01L21/60; (IPC1-7): C22C5/02; H01L21/60
Attorney, Agent or Firm:
Hayakawa Masaname